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STTH602CSFY - STMicroelectronics

Description: Automotive ultrafast rectifier 200V, dual 2x3A,trr(max):24ns,Tj (max.):175 °C,VF (typ.):0.80 V.

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STTH602CSFY - STMicroelectronics PCB footprint - Other - Other - PSMC (TO-277A)_26
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STTH602CSFY Details

  • Manufacturer Part Number:

    STTH602CSFY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 3 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2020-11-09

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.45

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.17 V

  • JEDEC-95 Code:

    TO-277A

  • JESD-30 Code:

    R-PDSO-F3

  • Non-rep Pk Forward Current-Max:

    55 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    4 µA

  • Reverse Recovery Time-Max:

    0.031 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

STTH602CSFY Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the device. Additionally, ensure good thermal design, use a heat sink if necessary, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • The maximum safe operating area (SOA) for the STTH602CSFY is not explicitly stated in the datasheet. However, it's recommended to follow the guidelines provided in the application note AN439: 'Safe Operating Area (SOA) of Power MOSFETs' to ensure reliable operation within the device's ratings.
  • While the STTH602CSFY is suitable for high-frequency switching applications, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the application's switching frequency is within the device's recommended range.
  • To protect the STTH602CSFY from electrostatic discharge (ESD), follow proper handling and storage procedures, use ESD-protective packaging, and ensure that the device is properly grounded during assembly and testing.

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STTH602CSFY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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