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STY34NB50 - STMicroelectronics

Description: N channel MOSFET,STY34NB50 34A 500V

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STY34NB50 - STMicroelectronics - PCB symbol
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PCB Footprints
STY34NB50 - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - STY50N105DK5
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3D Models
STY34NB50 - STMicroelectronics - 3D model - Transistor Outline, Vertical - STY50N105DK5
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STY34NB50 Details

  • Manufacturer Part Number:

    STY34NB50

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247

  • Package Description:

    MAX247, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    34 A

  • Drain-source On Resistance-Max:

    0.13 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    104 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSIP-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    450 W

  • Pulsed Drain Current-Max (IDM):

    136 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-on Time-Max (ton):

    109 ns

STY34NB50 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation at high temperatures, ensure that the device is properly heatsinked, use a thermal interface material, and follow the recommended operating conditions and derating guidelines.
  • Key considerations for EMI and EMC compliance include using a shielded enclosure, minimizing loop areas, using decoupling capacitors, and following good PCB layout practices to reduce radiation and susceptibility.
  • To protect the device from overvoltage and overcurrent, use voltage regulators, overvoltage protection devices, and current limiting resistors, and ensure that the device is operated within its recommended operating conditions.
  • Recommended soldering and assembly techniques include using a soldering iron with a temperature-controlled tip, using a solder with a melting point below 220°C, and following the recommended reflow soldering profile.

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STY34NB50 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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