A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
The device is rated for operation up to 150°C. Ensure proper heat sinking, and consider using a heat sink or thermal interface material to reduce thermal resistance. Also, follow the recommended derating guidelines for voltage and current at elevated temperatures.
The SUP70101EL-GE3 has built-in ESD protection, but handling precautions are still necessary. Use an ESD wrist strap or mat, and handle the device by the body or pins, avoiding direct contact with the die. Store the device in an anti-static bag or container.
The SUP70101EL-GE3 is a commercial-grade device, but Vishay offers a range of high-reliability and aerospace-grade products. Contact Vishay's sales team to discuss custom or specialized options for high-reliability applications.
Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30 seconds maximum. For rework, use a low-temperature soldering iron (350°C max) and avoid applying excessive force or heat to the device.
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SUP70101EL-GE3 Overview
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