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SURS8360T3G-VF01 - onsemi

Description: Small Compact Surface Mountable Package with J-Bend Leads; Rectangular Package for Automated Handling; Highly Stable Oxide Passivated Junction; Low Forward Voltage Drop (0.71 to 1.05 Volts Max @ 3.0 A, TJ = 150 C) Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 217 mg (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Shipped in 16 mm Tape and Reel, 25

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SURS8360T3G-VF01 - onsemi - PCB symbol
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PCB Footprints
SURS8360T3G-VF01 - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMC 2−LEAD CASE 403AC ISSUE A
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SURS8360T3G-VF01 - onsemi - 3D model - Diodes Moulded - SMC 2−LEAD CASE 403AC ISSUE A
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SURS8360T3G-VF01 Details

  • Manufacturer Part Number:

    SURS8360T3G-VF01

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMC-2

  • Manufacturer Package Code:

    403AC

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HIGH VOLTAGE ULTRA FAST RECOVERY POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.28 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SURS8360T3G-VF01 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. A thermal pad on the bottom of the device should be connected to a thermal plane on the PCB.
  • Use a shielded enclosure, keep sensitive analog circuits away from the SURS8360T3G-VF01, and use a common-mode choke or ferrite bead on the input lines. Ensure proper grounding and decoupling of the device.
  • Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF and a voltage rating of 10V or higher for input and output capacitors. Place them as close to the device as possible.
  • Use a TVS (transient voltage suppressor) diode or a voltage clamp circuit to protect the device from input voltage transients. Ensure the TVS diode is rated for the maximum input voltage and has a response time faster than the device's overvoltage protection circuit.
  • Power on the device with a slow ramp-up of the input voltage (typically 10ms to 100ms). Ensure the POR circuit is designed to reset the device within 10ms to 100ms after power-on.

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SURS8360T3G-VF01 Overview

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Part Image SURS8360T3G onsemi

Rectifier Diode, 1 Phase, 1 Element, 4A, 600V V(RRM), Silicon