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SVF331R3K1CKU2 - NXP

Description: MPU VF3xxR RISC 32bit 266MHz Automotive 176-Pin LQFP EP Tray

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SVF331R3K1CKU2 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP176 (SOT506-2)
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SVF331R3K1CKU2 - NXP  - 3D model - Quad Flat Packages - LQFP176 (SOT506-2)
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SVF331R3K1CKU2 Details

  • Manufacturer Part Number:

    SVF331R3K1CKU2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    24 X 24 MM, 1.60 MM HEIGHT, LQFP-176

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Boundary Scan:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G176

  • JESD-609 Code:

    e3

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    176

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Speed:

    266 MHz

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.23 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

SVF331R3K1CKU2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SVF331R3K1CKU2 should prioritize signal integrity, minimize parasitic inductance, and ensure proper decoupling. NXP provides a recommended PCB layout in the application note AN11538, which includes guidelines for component placement, routing, and grounding.
  • To ensure the SVF331R3K1CKU2 operates within its recommended operating conditions, follow the guidelines in the datasheet for voltage, current, and temperature. Additionally, consider factors like power supply noise, input impedance, and output loading to prevent damage or malfunction.
  • The main difference between the SVF331R3K1CKU2 and SVF331R3K1CKU1 is the operating frequency range. The SVF331R3K1CKU2 operates from 30 kHz to 300 MHz, while the SVF331R3K1CKU1 operates from 30 kHz to 100 MHz. Other differences may include package type, pinout, and specific application notes.
  • To troubleshoot common issues with the SVF331R3K1CKU2, start by verifying the power supply, input signal, and output loading. Check for proper decoupling, signal integrity, and PCB layout. Use oscilloscopes or spectrum analyzers to measure the output signal and identify any anomalies. Consult the datasheet, application notes, and NXP's support resources for guidance.
  • The SVF331R3K1CKU2 has a maximum junction temperature of 150°C. To ensure proper thermal management, follow the guidelines in the datasheet for thermal resistance, power dissipation, and thermal derating. Consider using thermal vias, heat sinks, or other cooling mechanisms to maintain a safe operating temperature.

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SVF331R3K1CKU2 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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