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SW25-2G - Boyd Corporation

Description: Heat Sinks Heat Sink, TO218, Vertical, 11.4 Degree C/W, 3mm Thru-Hole, 25mm, No Mount Hole

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PCB Footprints
SW25-2G - Boyd Corporation PCB footprint - Other - Other - SW25-2G-2
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3D Models
SW25-2G - Boyd Corporation  - 3D model - Other - SW25-2G-2
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SW25-2G Details

  • Manufacturer Part Number:

    SW25-2G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.90.00.00

  • Manufacturer:

    Boyd Corporation

  • YTEOL:

    7.87

  • Body Material:

    ALUMINUM

  • Color:

    BLACK

  • Construction:

    EXTRUDED

  • Fin Orientation:

    RADIAL

  • Finish:

    ANODIZED

  • Height:

    25 mm

  • Length:

    34.5 mm

  • Thermal Resistance:

    13 Ω

  • Thermal Support Device Type:

    HEAT SINK

  • Width:

    12.5 mm

SW25-2G Frequently Asked Questions (FAQs)

  • The recommended torque value is 0.5-0.8 Nm (4.4-7.0 in-lbs) for the screw terminals to ensure secure connections.
  • Yes, the SW25-2G is designed to withstand high-vibration environments, with a vibration resistance of 10-2000 Hz, 10G peak acceleration.
  • Yes, the SW25-2G is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C (500°F).
  • The maximum operating temperature range for the SW25-2G is -40°C to 125°C (-40°F to 257°F).
  • Yes, the SW25-2G has a moisture sensitivity level (MSL) of 1, indicating it can withstand humid or wet environments, but it's recommended to follow proper handling and storage procedures.

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SW25-2G Overview

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