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SY100EL15LZG-TR - Microchip

Description: Clock Drivers & Distribution 3.3V 1:4 Clock Distribution

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SY100EL15LZG-TR Details

  • Manufacturer Part Number:

    SY100EL15LZG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP, SOP16,.25

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOIC-16

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Family:

    100EL

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.93 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.72 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    2.97 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.94 mm

SY100EL15LZG-TR Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Microchip's PCB layout guidelines, which include using a solid ground plane, minimizing trace lengths, and using thermal vias to dissipate heat. Additionally, ensure good airflow around the device and consider using a heat sink if operating in high-temperature environments.
  • To ensure reliable operation across the entire operating temperature range, follow proper PCB design and layout guidelines, use a reliable power supply, and ensure that the device is properly soldered and mounted. Additionally, consider using thermal protection devices and implementing temperature monitoring and compensation mechanisms in your design.
  • The SY100EL15LZG-TR is a high-speed, low-power ECL-to-LVPECL translator, making it suitable for applications such as clock distribution, data conversion, and signal conditioning in high-speed data acquisition systems, telecommunications equipment, and high-performance computing systems.
  • To troubleshoot common issues, start by verifying the power supply and clock signal integrity. Check for proper termination, signal attenuation, and noise coupling. Use oscilloscopes and logic analyzers to debug signal waveforms and timing. Consult Microchip's application notes and technical support resources for guidance on specific issues.
  • The SY100EL15LZG-TR offers a unique combination of high-speed performance, low power consumption, and small package size. Compared to similar devices from other manufacturers, it may have advantages in terms of power consumption, signal integrity, or package options. Consult the datasheet and manufacturer's documentation for a detailed comparison.

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SY100EL15LZG-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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