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SY100ELT21LZG - Microchip

Description: 3.3V Power Supply 2.0 ns Typical Propagation Delay Low Power Differential LVPECL Inputs 24 mA TTL Outputs Flow-Through Pinouts Available in 8-Lead SOIC Package

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SY100ELT21LZG - Microchip - PCB symbol
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SY100ELT21LZG - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - SOICN-8LD-PL-1..
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SY100ELT21LZG Details

  • Manufacturer Part Number:

    SY100ELT21LZG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Delay-Max:

    2.5 ns

  • Interface IC Type:

    PECL TO TTL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.95 mm

SY100ELT21LZG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and radiation.
  • Ensure good thermal conductivity by using a heat sink or thermal pad, and follow the recommended operating temperature range of -40°C to +125°C. Also, consider using a thermal interface material to improve heat transfer.
  • The SY100ELT21LZG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • The SY100ELT21LZG is not specifically designed for radiation-hardened applications. If radiation hardness is required, consider using a different device or consulting with Microchip's radiation-hardened product line.
  • Use a logic analyzer or oscilloscope to monitor the device's signals and verify that the input signals meet the recommended specifications. Check the power supply voltage and ensure that it's within the recommended range. Consult the datasheet and application notes for troubleshooting guidelines.

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SY100ELT21LZG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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