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SY100EP111UTG-TR - Microchip

Description: Buffers & Line Drivers 2.5-5V 1:10 PECL Fanout Buffer

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SY100EP111UTG-TR - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - AVR128DB32-I/PT-TQFP 32
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SY100EP111UTG-TR - Microchip  - 3D model - Quad Flat Packages - AVR128DB32-I/PT-TQFP 32
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SY100EP111UTG-TR Details

  • Manufacturer Part Number:

    SY100EP111UTG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP, TQFP32,.35SQ,32

  • Pin Count:

    32

  • Manufacturer Package Code:

    TQFP-32

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    LVECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

  • Family:

    100EP

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TQFP

  • Package Equivalence Code:

    TQFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE

  • Packing Method:

    TR

  • Power Supply Current-Max (ICC):

    120 mA

  • Propagation Delay (tpd):

    0.4 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.025 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • fmax-Min:

    3 MHz

SY100EP111UTG-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the SY100EP111UTG-TR involves keeping the input and output traces short and direct, using a solid ground plane, and minimizing the distance between the device and the bypass capacitors. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To properly bypass the SY100EP111UTG-TR, use a 0.1uF ceramic capacitor between the VCC pin and the GND pin, and a 10uF electrolytic capacitor between the VCC pin and the GND pin. Place the capacitors as close to the device as possible.
  • The SY100EP111UTG-TR has an operating temperature range of -40°C to +85°C. However, the device can be operated at temperatures up to +125°C for short periods of time, but this may affect its reliability and lifespan.
  • The SY100EP111UTG-TR has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
  • The recommended soldering profile for the SY100EP111UTG-TR is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. The device should be soldered using a no-clean or water-soluble flux.

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SY100EP111UTG-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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