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SY55855VKG-TR - Microchip

Description: Translation - Voltage Levels LVDS translator

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SY55855VKG-TR - Microchip - PCB symbol
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PCB Footprints
SY55855VKG-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 10 LEAD MSOP (K10-1)
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SY55855VKG-TR - Microchip - 3D model - Small Outline Packages - 10 LEAD MSOP (K10-1)
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SY55855VKG-TR Details

  • Manufacturer Part Number:

    SY55855VKG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP, TSSOP10,.19,20

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    CML-TO-LVDS TRANSLATION ALSO POSSIBLE

  • Delay-Max:

    0.7 ns

  • Interface IC Type:

    PECL TO LVDS TRANSLATOR

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    80 mA

  • Supply Voltage-Max:

    5.7 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

SY55855VKG-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the SY55855VKG-TR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper powering and decoupling, use a high-quality power supply with low noise and ripple. Add decoupling capacitors (e.g., 0.1uF and 10uF) close to the device, and consider adding a 10-ohm resistor in series with the power supply to reduce noise.
  • The SY55855VKG-TR has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device will be operating at high temperatures or high currents.
  • To troubleshoot issues, start by verifying the power supply and decoupling. Check for proper signal termination and impedance matching. Use an oscilloscope to verify signal integrity and check for noise or distortion. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • Yes, the SY55855VKG-TR is a high-speed device and requires proper EMI/EMC design considerations. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference. Follow the PCB layout guidelines and use EMI-absorbing materials to reduce radiation.

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SY55855VKG-TR Overview

Use the download button to access the SY55855VKG-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SY558, or try a keyword search, such as Level Translators

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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