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SY55855VKG - Microchip

Description: Microchip SY55855VKG, Logic Level Translator, CML to LVDS, LVPECL to LVDS, PECL to LVDS, LVDS, 3 → 5.7 V, 10-Pin

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SY55855VKG - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 10-MSOP MM
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SY55855VKG - Microchip  - 3D model - Small Outline Packages - 10-MSOP MM
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SY55855VKG Details

  • Manufacturer Part Number:

    SY55855VKG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    CML-TO-LVDS TRANSLATION ALSO POSSIBLE

  • Delay-Max:

    0.7 ns

  • Interface IC Type:

    PECL TO LVDS TRANSLATOR

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    80 mA

  • Supply Voltage-Max:

    5.7 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

SY55855VKG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow and avoid blocking airflow around the device. Consider using a thermal interface material to improve heat transfer.
  • Choose a capacitor with a low ESR, high ripple current rating, and a voltage rating that exceeds the maximum input voltage. X7R or X5R ceramic capacitors are recommended.
  • Check the input voltage, output load, and PCB layout. Verify that the input capacitor is properly selected and placed. Use an oscilloscope to monitor the output voltage and current. Consult the datasheet and application notes for guidance.
  • Operating at a lower input voltage may reduce the output voltage, increase the dropout voltage, and affect the device's efficiency and stability. Consult the datasheet for minimum input voltage requirements.

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SY55855VKG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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