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SY58051AUMG - Microchip

Description: Logic Gates Ultra-Precision CML AnyGate,,with Internal Input and Output Termination

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SY58051AUMG - Microchip - PCB symbol
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PCB Footprints
SY58051AUMG - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-PIN QFN
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3D Models
SY58051AUMG - Microchip - 3D model - Quad Flat No-Lead - 16-PIN QFN
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SY58051AUMG Details

  • Manufacturer Part Number:

    SY58051AUMG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    3 X 3 MM, LEAD FREE, QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 2.97 TO 3.63 V SUPPLY

  • Family:

    58051

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Logic IC Type:

    LOGIC CIRCUIT

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.95 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

SY58051AUMG Frequently Asked Questions (FAQs)

  • A good PCB layout for the SY58051AUMG involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. Microchip provides a recommended PCB layout in the datasheet and application notes.
  • To ensure proper power and decoupling, use a low-ESR capacitor (e.g., 0.1 μF) between VCC and GND, and a larger capacitor (e.g., 10 μF) for bulk decoupling. Place these capacitors close to the device, and use a low-inductance path to the power supply.
  • The SY58051AUMG has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking airflow around the device. Follow Microchip's thermal design guidelines for optimal thermal performance.
  • To troubleshoot issues, start by verifying the power supply and decoupling, then check the input and output signals using an oscilloscope. Consult the datasheet and application notes for specific troubleshooting guidelines and common pitfalls to avoid.
  • Yes, the SY58051AUMG is a high-frequency device and requires proper EMI/EMC design considerations. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference. Follow Microchip's EMI/EMC design guidelines and industry standards for optimal performance.

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SY58051AUMG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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