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SY58605UMG-TR - Microchip

Description: Buffers & Line Drivers 3.2Gbps LVDS Buffer w/ FSI Inputs

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SY58605UMG-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - SY58605UMG
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SY58605UMG-TR - Microchip  - 3D model - Small Outline No-lead - SY58605UMG
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SY58605UMG-TR Details

  • Manufacturer Part Number:

    SY58605UMG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    VDFN-8

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Family:

    58605

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    0.42 ns

  • Propagation Delay (tpd):

    0.42 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

  • fmax-Min:

    2000 MHz

SY58605UMG-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode filter or a ferrite bead to reduce EMI.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Use a thermal interface material to improve heat transfer between the device and the heat sink. Follow the recommended operating conditions and derating guidelines.
  • Use a shielded enclosure, keep the device away from antennas and other noise sources, and use EMI filters or ferrite beads on the input and output lines. Ensure proper grounding and decoupling of the device.
  • Check the input voltage, output load, and temperature. Verify the device is properly configured and the output voltage is within the specified range. Use an oscilloscope to monitor the output voltage and check for noise or oscillations.
  • Operating at the maximum rated temperature can reduce the device's lifespan and affect its performance. Ensure proper thermal management and consider derating the device for high-temperature applications.

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SY58605UMG-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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