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SY88903ALKG-TR - Microchip

Description: Limiting Amplifiers 3.3V 1.25Gbps PECL Post Amp

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SY88903ALKG-TR - Microchip - PCB symbol
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PCB Footprints
SY88903ALKG-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 10-Pin MSOP(K10-1)
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3D Models
SY88903ALKG-TR - Microchip - 3D model - Small Outline Packages - 10-Pin MSOP(K10-1)
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SY88903ALKG-TR Details

  • Manufacturer Part Number:

    SY88903ALKG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Applications:

    SDH; SONET

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    39 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ATM/SONET/SDH SUPPORT CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

SY88903ALKG-TR Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the application note AN-2141, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • Microchip recommends using their Power Designer tool to simulate and analyze the power supply design. Additionally, the application note AN-2141 provides troubleshooting guidelines and common pitfalls to avoid. Engineers can also contact Microchip's technical support for further assistance.
  • The SY88903ALKG-TR has a maximum junction temperature of 150°C. To ensure reliable operation, engineers should follow the thermal management guidelines in the datasheet, including using a heat sink, optimizing PCB layout, and minimizing thermal resistance. Microchip also provides a thermal model for the device in the Power Designer tool.
  • Yes, the SY88903ALKG-TR can be used in redundant or parallel configurations. However, engineers should carefully follow the guidelines in the application note AN-2141 and ensure that the devices are properly synchronized and configured to avoid oscillations or other issues.
  • The SY88903ALKG-TR is designed to meet EMI and EMC regulatory standards, but engineers should still follow best practices for PCB layout, component selection, and shielding to minimize EMI. Microchip provides guidance on EMI and EMC considerations in the application note AN-2141 and the datasheet.

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SY88903ALKG-TR Overview

Use the download button to access the SY88903ALKG-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SY889, or try a keyword search, such as ATM/SONET/SDH ICs

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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