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SY89112UMY - Microchip

Description: Clock Fanout Buffer 12-OUT 2-IN 1:12 44-Pin QFN EP Tray

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SY89112UMY - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 44-Pin QFN
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SY89112UMY - Microchip  - 3D model - Quad Flat No-Lead - 44-Pin QFN
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SY89112UMY Details

  • Manufacturer Part Number:

    SY89112UMY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    44

  • Manufacturer Package Code:

    VQFN-44

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 3.3V SUPPLY

  • Family:

    89112

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N44

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Number of True Outputs:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-EMITTER

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC44,.28SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Propagation Delay (tpd):

    0.55 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.025 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • fmax-Min:

    2000 MHz

SY89112UMY Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal management strategy such as heat sinks, thermal vias, or thermal pads to keep the junction temperature below 125°C. Ensure proper airflow and avoid thermal hotspots.
  • Use a combination of bulk capacitors (e.g., 10uF) and bypass capacitors (e.g., 100nF) to filter out noise and ripple. Place decoupling capacitors close to the device and use a low-ESR capacitor for the bulk capacitor.
  • Use the device's power-down modes, reduce the clock frequency, and minimize the number of active circuits. Consider using a low-power oscillator or a clock generator with a low-power mode.
  • Use a shielded enclosure, keep sensitive circuits away from the device, and use EMI filters or common-mode chokes on I/O lines. Ensure proper grounding and use a low-pass filter on the power supply.

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SY89112UMY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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