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SY89296UTG - Microchip

Description: Delay Line IC Programmable 1024 Tap 3.2ns ~ 14.8ns 32-Pin TQFP

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PCB Footprints
SY89296UTG - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 32-PIN TQFP (T32-1)_2023
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3D Models
SY89296UTG - Microchip  - 3D model - Quad Flat Packages - 32-PIN TQFP (T32-1)_2023
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SY89296UTG Details

  • Manufacturer Part Number:

    SY89296UTG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, TQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    TQFP-32

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES WITH 3.3V NOMINAL SUPPLY VOLTAGE

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Logic IC Type:

    ACTIVE DELAY LINE

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Taps/Steps:

    1023

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE

  • Packing Method:

    TRAY

  • Programmable Delay Line:

    YES

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

SY89296UTG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal management strategy such as heat sinks, thermal vias, or thermal pads to keep the junction temperature below 125°C. Ensure proper airflow and avoid thermal hotspots.
  • Use a combination of bulk capacitors (e.g., 10uF) and bypass capacitors (e.g., 100nF) close to the device. Ensure the power supply is stable and well-regulated to prevent voltage drops.
  • Use the device's power-down modes, reduce the clock frequency, and minimize the number of active circuits. Consider using a low-power oscillator or a clock generator with a low-power mode.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and use EMI filters or chokes on the power and signal lines. Ensure proper grounding and shielding of cables.

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SY89296UTG Overview

Use the download button to access the SY89296UTG schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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For a full list of alternate parts for SY89296UTG, check out Findchips.com