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SY89321LMG-TR - Microchip

Description: Translation - Voltage Levels 3.3V 800MHz Ultrasmall Dual LVTTL-to-LVPECL Translator

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SY89321LMG-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - (MLF-8)
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3D Models
SY89321LMG-TR - Microchip  - 3D model - Small Outline No-lead - (MLF-8)
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SY89321LMG-TR Details

  • Manufacturer Part Number:

    SY89321LMG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON, SOLCC8,.08,20

  • Pin Count:

    8

  • Manufacturer Package Code:

    VDFN-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Delay-Max:

    2.5 ns

  • Interface IC Type:

    PECL TO TTL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9754 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

SY89321LMG-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode choke or a ferrite bead to filter the input power.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Use a thermal interface material (TIM) between the device and the heat sink. Follow the recommended operating conditions and derating guidelines.
  • The input clock signal should have a frequency of 25 MHz ±100 ppm, with a duty cycle of 40% to 60%. The clock signal should have a rise and fall time of 1 ns or less, and a jitter of less than 100 ps.
  • Use the power-down mode when the device is not in use. Reduce the clock frequency or use a lower power mode when possible. Optimize the PCB design to minimize power consumption and reduce voltage drops.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Ensure that the PCB design includes a solid ground plane and a separate power plane. Follow proper handling and storage procedures to prevent ESD damage.

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SY89321LMG-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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