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SY89327LMG-TR - Microchip

Description: Translation - Voltage Levels 3.3V Ultrasmall Any-Input-to-LVPECL Translator

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SY89327LMG-TR - Microchip - PCB symbol
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PCB Footprints
SY89327LMG-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - SY89327LMG-TR-1
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SY89327LMG-TR - Microchip - 3D model - Small Outline No-lead - SY89327LMG-TR-1
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SY89327LMG-TR Details

  • Manufacturer Part Number:

    SY89327LMG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON, SOLCC8,.08,20

  • Pin Count:

    8

  • Manufacturer Package Code:

    VDFN-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Delay-Max:

    0.4 ns

  • Interface IC Type:

    TTL/CMOS TO PECL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9754 mm

  • Supply Current-Max:

    45 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

SY89327LMG-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal pad or a heat sink to dissipate heat, and ensure good airflow around the device. Also, follow the recommended operating conditions and derating guidelines in the datasheet.
  • Operating the device outside the recommended input voltage range may affect its performance, reliability, and lifespan. It may also lead to increased power consumption, heat generation, and reduced output voltage accuracy.
  • Check the input voltage, output load, and PCB layout. Verify that the device is properly configured and that the output capacitor values meet the recommended specifications. Use an oscilloscope to measure the output voltage and check for noise or oscillations.
  • Yes, but ensure that you follow the recommended design and testing guidelines for high-reliability or safety-critical applications. Also, consult with Microchip's technical support and review the device's reliability and quality data.

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SY89327LMG-TR Overview

Use the download button to access the SY89327LMG-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SY893, or try a keyword search, such as Level Translators

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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