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SY89547LMG-TR - Microchip

Description: Encoders, Decoders, Multiplexers & Demultiplexers 3.3V, 3.2Gbps 4:1 LVDS Multiplexer w/ 1:2 Fanout

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SY89547LMG-TR - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN
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SY89547LMG-TR - Microchip  - 3D model - Quad Flat No-Lead - QFN
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SY89547LMG-TR Details

  • Manufacturer Part Number:

    SY89547LMG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5 X 5 MM, LEAD FREE, MLF-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    VQFN-32

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Family:

    89547

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Logic IC Type:

    MULTIPLEXER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Inputs:

    4

  • Number of Outputs:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.54 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.95 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

SY89547LMG-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow and avoid blocking airflow around the device. Consider using a thermal interface material to improve heat transfer.
  • Use a 50-ohm termination resistor at the input and output of the device. For high-speed signals, consider using a differential termination scheme to minimize reflections and improve signal integrity.
  • Use an oscilloscope to measure signal waveforms and power supply noise. Check for signal reflections, ringing, and overshoot. Verify that the power supply is stable and within the recommended voltage range.
  • Use a combination of ceramic and electrolytic capacitors to decouple the power supply. A 10uF ceramic capacitor and a 10uF electrolytic capacitor in parallel are recommended.

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SY89547LMG-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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