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SY89826LHY - Microchip

Description: Clock Drivers & Distribution 3.3V 1:22 LVDS Fanout/Translator

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PCB Footprints
SY89826LHY - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 64-PIN EPAD-TQFP (DIE UP) (H64-1)
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3D Models
SY89826LHY - Microchip  - 3D model - Quad Flat Packages - 64-PIN EPAD-TQFP (DIE UP) (H64-1)
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SY89826LHY Details

  • Manufacturer Part Number:

    SY89826LHY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    TQFP-64

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Family:

    89826

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of True Outputs:

    22

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • Propagation Delay (tpd):

    1.45 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.075 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • fmax-Min:

    1000 MHz

SY89826LHY Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
  • Follow the power-up sequence outlined in the datasheet. Ensure the input voltage is within the recommended range, and the EN pin is properly configured. Use the reset pin to initialize the device.
  • The device has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink if the device is expected to operate in high-temperature environments.
  • Use an oscilloscope to monitor the input and output signals. Check the power supply voltage, and ensure the device is properly configured. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, the device is sensitive to EMI. Use a common mode choke, and ensure the PCB layout is designed to minimize EMI. Follow the recommended layout guidelines in the datasheet.

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SY89826LHY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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