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SY89832UMG-TR - Microchip

Description: LVDS Interface IC 2.5V 1:4 LVDS Fanout Buffer

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SY89832UMG-TR - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN33-16LD-PL-3
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SY89832UMG-TR - Microchip  - 3D model - Quad Flat No-Lead - QFN33-16LD-PL-3
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SY89832UMG-TR Details

  • Manufacturer Part Number:

    SY89832UMG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Family:

    89832

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.57 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.02 ns

  • Seated Height-Max:

    0.95 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

  • fmax-Min:

    2500 MHz

SY89832UMG-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Follow the recommended operating conditions and derating guidelines for temperature and voltage.
  • The datasheet provides general guidelines, but for specific applications, consider the clock frequency, data rate, and signal integrity. Consult with Microchip's application notes and technical support for customized guidance.
  • Use a logic analyzer or oscilloscope to capture signal waveforms. Check the device's status registers and error flags. Consult Microchip's application notes and technical support for guidance on debugging and troubleshooting.
  • Follow the recommended power-up and power-down sequences to ensure proper device operation. Ensure the reset signal is properly asserted and de-asserted to prevent latch-up or incorrect device operation.

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SY89832UMG-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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