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SY89838UMG - Microchip

Description: 1:8 LVDS Clock Buffer, 2:1 Mux MLF32

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PCB Footprints
SY89838UMG - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SY89838UMG-1
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3D Models
SY89838UMG - Microchip  - 3D model - Quad Flat No-Lead - SY89838UMG-1
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SY89838UMG Details

  • Manufacturer Part Number:

    SY89838UMG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    32

  • Manufacturer Package Code:

    VQFN-32

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Family:

    89838

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Power Supply Current-Max (ICC):

    350 mA

  • Prop. Delay@Nom-Sup:

    0.04 ns

  • Propagation Delay (tpd):

    0.95 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.04 ns

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • fmax-Min:

    1500 MHz

SY89838UMG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks short and away from noise sources. Use a common mode choke or a ferrite bead to filter the input.
  • Use a soft-start circuit to limit the inrush current during start-up. For shutdown, ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • The device has a thermal pad that must be connected to a thermal plane on the PCB. Ensure good thermal conductivity and consider using a heat sink or thermal interface material for high-power applications.
  • Use the recommended compensation network values in the datasheet as a starting point. Then, adjust the values based on the specific application requirements and PCB layout. Simulation tools or empirical methods can be used to fine-tune the compensation network.
  • Use a shielded enclosure and ensure good PCB layout practices to minimize EMI. Add EMI filters or common mode chokes to the input and output lines as needed. Follow the relevant EMC standards and regulations for the target application.

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SY89838UMG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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