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SY89853UMG - Microchip

Description: SY89853UMG, Clock Buffer LVPECL LVPECL, 1-Input, 32-Pin QFN

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PCB Footprints
SY89853UMG - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32-Pin QFN-ren1
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SY89853UMG - Microchip  - 3D model - Quad Flat No-Lead - 32-Pin QFN-ren1
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SY89853UMG Details

  • Manufacturer Part Number:

    SY89853UMG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    VQFN-32

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    ALSO OPERATES AT 3.3V SUPPLY

  • Family:

    89853

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Inputs:

    2

  • Number of Outputs:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Power Supply Current-Max (ICC):

    85 mA

  • Propagation Delay (tpd):

    0.36 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • fmax-Min:

    2500 MHz

SY89853UMG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal management strategy such as heat sinks, thermal interfaces, and thermal vias to keep the junction temperature below 125°C. Also, ensure proper PCB design and layout to minimize thermal gradients.
  • Use a 50-ohm termination resistor in series with the input signal and a 50-ohm load termination at the output. For high-speed signals, use a differential termination scheme with 100-ohm differential impedance.
  • Ensure that the power supplies are sequenced correctly, with the analog supply (VCCA) powered up before the digital supply (VCCD). The reset signal (RESETB) should be asserted low for at least 10 ms during power-up and held low until the power supplies are stable.
  • Use a combination of ceramic and electrolytic capacitors for bypassing and decoupling. Place 0.1 uF ceramic capacitors close to the power pins and 10 uF electrolytic capacitors near the power supply sources. Ensure that the capacitors are properly sized and placed to minimize inductance and resistance.

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SY89853UMG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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