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SY89873LMG-TR - Microchip

Description: Clock Drivers & Distribution 3.3V LVDS Output Clock Divider/Fanout

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SY89873LMG-TR - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-PIN QFN (QFN-16)
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SY89873LMG-TR - Microchip  - 3D model - Quad Flat No-Lead - 16-PIN QFN (QFN-16)
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SY89873LMG-TR Details

  • Manufacturer Part Number:

    SY89873LMG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQCCN, LCC16,.12SQ,20

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    IT ALSO HAS CLOCK OUTPUTS QA AND QA BAR WITH DIFFERENTIAL MUX INPUT CONDITIONING

  • Family:

    89873

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.8 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.03 ns

  • Seated Height-Max:

    0.95 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

  • fmax-Min:

    2000 MHz

SY89873LMG-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal pad or a heat sink to dissipate heat, and ensure good airflow around the device. Also, follow the recommended operating conditions and derating guidelines in the datasheet.
  • Use a 10uF ceramic capacitor and a 1uF ceramic capacitor in parallel, placed as close as possible to the device's power pins. Add a 0.1uF ceramic capacitor for high-frequency decoupling.
  • Check the input voltage, output load, and feedback resistors. Verify that the device is properly configured and that the output voltage is within the specified range. Use an oscilloscope to measure the output voltage and check for noise or oscillations.
  • Using a different inductor value or type can affect the device's performance, efficiency, and stability. Consult the datasheet and application notes for guidance on inductor selection and optimization.

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SY89873LMG-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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