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SY89873LMG - Microchip

Description: Clock Drivers & Distribution 3.3V LVDS Output Clock Divider/Fanout

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PCB Footprints
SY89873LMG - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-Pin QFN
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3D Models
SY89873LMG - Microchip  - 3D model - Quad Flat No-Lead - 16-Pin QFN
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SY89873LMG Details

  • Manufacturer Part Number:

    SY89873LMG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MLF-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    AVAILABLE DIVIDER RATIO ARE 2, 4, 8,16

  • Family:

    89873

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Propagation Delay (tpd):

    0.8 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.03 ns

  • Seated Height-Max:

    0.95 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

  • fmax-Min:

    2000 MHz

SY89873LMG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
  • Follow the power-up sequence outlined in the datasheet, and ensure the EN pin is high during power-up. Also, configure the device using the SPI interface, and verify the configuration using the status registers.
  • The device has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking the thermal pads. Monitor the device temperature using the thermal monitoring feature.
  • Use the built-in diagnostic features, such as the error registers and the loopback mode. Also, verify the PCB layout, power supply, and configuration settings. Consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, follow the recommended PCB layout and use a common mode choke to reduce EMI. Ensure the device is properly shielded, and use EMI filters if necessary. Consult the datasheet and application notes for EMI and EMC guidelines.

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SY89873LMG Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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