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SZ1SMA5913BT3G - onsemi

Description: Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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SZ1SMA5913BT3G - onsemi - PCB symbol
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PCB Footprints
SZ1SMA5913BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - NRVBA1H100T3G
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SZ1SMA5913BT3G - onsemi - 3D model - Diodes Moulded - NRVBA1H100T3G
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SZ1SMA5913BT3G Details

  • Manufacturer Part Number:

    SZ1SMA5913BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403D-02, SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    10 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    500 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3.3 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    113.6 mA

SZ1SMA5913BT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZ1SMA5913BT3G is a standard SOT23 package with a 1.3mm x 1.3mm body size and a 0.5mm pitch. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure proper biasing, follow the recommended operating conditions in the datasheet, including the input voltage range (1.8V to 5.5V) and the recommended output capacitor value (1uF to 10uF). Additionally, ensure the input voltage is stable and noise-free.
  • The maximum allowable power dissipation for the SZ1SMA5913BT3G is 250mW. Exceeding this limit may cause the device to overheat, leading to reduced performance or even failure.
  • The SZ1SMA5913BT3G is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure proper thermal management and follow the recommended operating conditions to minimize thermal stress.
  • The SZ1SMA5913BT3G has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent ESD damage. Use an anti-static wrist strap or mat, and store the devices in anti-static packaging.

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SZ1SMA5913BT3G Overview

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