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SZ1SMA5918BT3G - onsemi

Description: Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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SZ1SMA5918BT3G - onsemi - PCB symbol
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SZ1SMA5918BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - 1SMA5928BT3G+
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SZ1SMA5918BT3G - onsemi - 3D model - Diodes Moulded - 1SMA5928BT3G+
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SZ1SMA5918BT3G Details

  • Manufacturer Part Number:

    SZ1SMA5918BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403D-02, SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    4 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    350 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    5.1 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Test Voltage:

    2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    73.5 mA

SZ1SMA5918BT3G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended for optimal heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (–40°C to 150°C). Use a heat sink or thermal interface material to maintain a safe junction temperature. Monitor the device's thermal performance and adjust the system design accordingly.
  • The SZ1SMA5918BT3G has built-in ESD protection diodes. However, it is still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges, and avoid voltage spikes or transients.
  • Yes, the SZ1SMA5918BT3G is qualified for automotive and high-reliability applications. However, it is essential to follow the recommended design and testing guidelines to ensure the device meets the required reliability and quality standards.
  • Consult the onsemi application note for troubleshooting guidelines. Perform a thorough analysis of the system design, PCB layout, and component selection to identify potential issues. Use debugging tools and techniques, such as oscilloscopes and logic analyzers, to diagnose the problem.

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SZ1SMA5918BT3G Overview

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