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SZ1SMA5921BT3G - onsemi

Description: Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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SZ1SMA5921BT3G - onsemi - PCB symbol
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PCB Footprints
SZ1SMA5921BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D-02
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SZ1SMA5921BT3G - onsemi - 3D model - Diodes Moulded - SMA CASE 403D-02
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SZ1SMA5921BT3G Details

  • Manufacturer Part Number:

    SZ1SMA5921BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403D-02, SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    2.5 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    200 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    6.8 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Test Voltage:

    5.2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    55.1 mA

SZ1SMA5921BT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZ1SMA5921BT3G should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure reliable operation across the full temperature range, follow the recommended operating conditions, and consider the device's thermal derating. Implement proper thermal management, and ensure the device is not exposed to excessive temperatures during storage or operation.
  • Follow the recommended soldering profile and handling procedures outlined in the onsemi application note AN10426. Use a soldering iron with a temperature range of 250°C to 260°C, and avoid exposing the device to excessive mechanical stress or vibration.
  • Use a systematic approach to troubleshoot issues. Verify the device is properly soldered and connected. Check the input and output voltages, and ensure the device is operating within the recommended specifications. Use oscilloscopes or logic analyzers to debug signal integrity issues.
  • The SZ1SMA5921BT3G has built-in ESD protection, but handling precautions are still necessary. Use an ESD wrist strap or mat, and ensure the device is stored in an ESD-safe environment. Avoid touching the device's pins or handling it in a way that could generate static electricity.

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SZ1SMA5921BT3G Overview

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