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SZ1SMA5926BT3G - onsemi

Description: Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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PCB Footprints
SZ1SMA5926BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D-02
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3D Models
SZ1SMA5926BT3G - onsemi  - 3D model - Diodes Moulded - SMA CASE 403D-02
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SZ1SMA5926BT3G Details

  • Manufacturer Part Number:

    SZ1SMA5926BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403D-02, SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    5.5 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    550 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    11 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    8.4 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    34.1 mA

SZ1SMA5926BT3G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, it's recommended to use a 2-3 layer PCB with a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and avoid thermal hotspots on the PCB.
  • The SZ1SMA5926BT3G has an integrated ESD protection diode, but it's still important to follow proper ESD handling precautions during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device pins or handling the device in a way that could generate static electricity.
  • The SZ1SMA5926BT3G is a commercial-grade device, but onsemi does offer automotive-grade and high-reliability versions of similar devices. If you need a device for a high-reliability or automotive application, consider using a device specifically designed and qualified for those markets, such as the AEC-Q101 qualified version.
  • To determine the optimal biasing conditions, refer to the datasheet and application notes provided by onsemi. The recommended biasing conditions will depend on the specific application and operating conditions. Consider factors such as the input voltage, output current, and operating frequency when selecting the biasing conditions.

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SZ1SMA5926BT3G Overview

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Part Image HSMBJ5926BE3 Microsemi Corporation (now Microchip)

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Part Image HSMBJ5926B Microsemi Corporation (now Microchip)

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Part Image HSMBJ5926BTR Microsemi Corporation (now Microchip)

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For a full list of alternate parts for SZ1SMA5926BT3G, check out Findchips.com