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SZ1SMA5942BT3G - onsemi

Description: Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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PCB Footprints
SZ1SMA5942BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D-02
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SZ1SMA5942BT3G - onsemi  - 3D model - Diodes Moulded - SMA CASE 403D-02
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SZ1SMA5942BT3G Details

  • Manufacturer Part Number:

    SZ1SMA5942BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403D-02, SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    70 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1100 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    51 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    38.8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    7.3 mA

SZ1SMA5942BT3G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can help reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended operating temperature range (up to 150°C) and consider the device's power dissipation. Implementing thermal management techniques, such as heat sinks or thermal interfaces, can also help maintain a safe operating temperature.
  • The SZ1SMA5942BT3G has built-in ESD protection, but it is still important to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.
  • Yes, the SZ1SMA5942BT3G is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101, which ensures the device can withstand the harsh conditions found in automotive environments. However, it is essential to follow the recommended operating conditions and qualification guidelines for these applications.
  • To prevent damage, store the SZ1SMA5942BT3G in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the leads or electrical contacts. Use anti-static packaging and follow proper ESD handling procedures to prevent damage during storage and handling.

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SZ1SMA5942BT3G Overview

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