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SZ1SMB12AT3G - LITTELFUSE

Description: ESD Suppressors / TVS Diodes 12V 600W UNI-DIR SZ1SMB AEC-Q101

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Symbol
SZ1SMB12AT3G - LITTELFUSE - PCB symbol
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PCB Footprints
SZ1SMB12AT3G - LITTELFUSE PCB footprint - Diodes Moulded - Diodes Moulded - SMB (Pb−Free)
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3D Models
SZ1SMB12AT3G - LITTELFUSE - 3D model - Diodes Moulded - SMB (Pb−Free)
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SZ1SMB12AT3G Details

  • Manufacturer Part Number:

    SZ1SMB12AT3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Breakdown Voltage-Max:

    14.7 V

  • Breakdown Voltage-Min:

    13.3 V

  • Breakdown Voltage-Nom:

    14 V

  • Clamping Voltage-Max:

    19.9 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SZ1SMB12AT3G Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SZ1SMB12AT3G can be found in the Littelfuse application note AN9313, which provides guidelines for surface mount assembly of SMB packages.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating curves provided in the datasheet, and to consider the maximum junction temperature (Tj) of 150°C. Additionally, ensure that the device is properly soldered and that the PCB is designed to dissipate heat effectively.
  • Yes, the SZ1SMB12AT3G is AEC-Q101 qualified, which means it meets the stringent requirements for automotive applications. However, it is recommended to consult with Littelfuse or an authorized distributor to ensure that the device meets the specific requirements of the application.
  • The SZ1SMB12AT3G can withstand a maximum surge current of 12A, as specified in the datasheet. However, it is recommended to consult with Littelfuse or an authorized distributor to determine the suitability of the device for specific applications.
  • The recommended lead-free reflow profile for the SZ1SMB12AT3G can be found in the Littelfuse application note AN9313. The profile should be adjusted based on the specific PCB design and manufacturing process.

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SZ1SMB12AT3G Overview

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