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SZ1SMB33AT3G - LITTELFUSE

Description: ESD Suppressors / TVS Diodes 33V 600W UNI-DIR SZ1SMB AEC-Q101

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Symbol
SZ1SMB33AT3G - LITTELFUSE - PCB symbol
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PCB Footprints
SZ1SMB33AT3G - LITTELFUSE PCB footprint - Diodes Moulded - Diodes Moulded - SZ1SMB33AT3G
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SZ1SMB33AT3G - LITTELFUSE - 3D model - Diodes Moulded - SZ1SMB33AT3G
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SZ1SMB33AT3G Details

  • Manufacturer Part Number:

    SZ1SMB33AT3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Breakdown Voltage-Max:

    40.6 V

  • Breakdown Voltage-Min:

    36.7 V

  • Breakdown Voltage-Nom:

    38.65 V

  • Clamping Voltage-Max:

    53.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    33 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    33 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SZ1SMB33AT3G Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SZ1SMB33AT3G can be found in the Littelfuse application note AN9313, which provides guidelines for PCB layout and assembly.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating curves provided in the datasheet, and to consider the maximum junction temperature (Tj) of 150°C. Additionally, ensure proper thermal management and heat sinking to prevent overheating.
  • Yes, the SZ1SMB33AT3G can be used in high-frequency applications up to 1 GHz. However, it is recommended to consult the datasheet for specific frequency-related characteristics and to consider the device's parasitic capacitance and inductance.
  • The maximum surge current rating for the SZ1SMB33AT3G is 3000 A, as specified in the datasheet. This rating is based on a 10/1000 μs waveform.
  • Yes, the SZ1SMB33AT3G is compatible with lead-free soldering processes. Littelfuse ensures that their products meet the requirements of the European Union's RoHS (Restriction of Hazardous Substances) directive.

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SZ1SMB33AT3G Overview

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