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SZ1SMB58AT3G - LITTELFUSE

Description: ESD Suppressors / TVS Diodes 58V 600W UNI-DIR SZ1SMB AEC-Q101

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Symbol
SZ1SMB58AT3G - LITTELFUSE - PCB symbol
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PCB Footprints
SZ1SMB58AT3G - LITTELFUSE PCB footprint - Other - Other - DO-214AA, SMB_2023-1
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3D Models
SZ1SMB58AT3G - LITTELFUSE - 3D model - Other - DO-214AA, SMB_2023-1
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SZ1SMB58AT3G Details

  • Manufacturer Part Number:

    SZ1SMB58AT3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Breakdown Voltage-Max:

    71.2 V

  • Breakdown Voltage-Min:

    64.4 V

  • Breakdown Voltage-Nom:

    67.8 V

  • Clamping Voltage-Max:

    93.6 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    58 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    58 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SZ1SMB58AT3G Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SZ1SMB58AT3G can be found in the Littelfuse application note AN9313, which provides guidelines for PCB layout and assembly.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a thermally conductive interface material to improve heat dissipation.
  • While the SZ1SMB58AT3G is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 1 MHz. However, the device's performance may degrade at higher frequencies, and additional filtering or impedance matching may be required.
  • To select the correct variant, consider the required voltage rating, current rating, and package type. The datasheet provides a selection guide and a part number construction guide to help with the selection process.
  • The SZ1SMB58AT3G has a human body model (HBM) ESD rating of 30 kV and a machine model (MM) ESD rating of 400 V. It also has latch-up protection, but the specific latch-up current rating is not specified in the datasheet.

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SZ1SMB58AT3G Overview

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