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SZ1SMB5921BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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PCB Footprints
SZ1SMB5921BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB
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SZ1SMB5921BT3G - onsemi  - 3D model - Diodes Moulded - SMB
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SZ1SMB5921BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5921BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    2.5 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    200 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    6.8 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    5.2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    55.1 mA

SZ1SMB5921BT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZ1SMB5921BT3G involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a common ground point for the input and output grounds.
  • To ensure proper biasing, make sure to follow the recommended biasing circuit in the datasheet, and use a stable voltage source. Also, ensure that the input voltage is within the recommended range, and that the output is properly terminated.
  • The SZ1SMB5921BT3G has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, especially in high-power applications. A thermal pad or heat sink can be used to dissipate heat.
  • To troubleshoot issues with the SZ1SMB5921BT3G, start by checking the input and output voltages, and ensuring that the device is properly biased. Check for any signs of overheating, and verify that the PCB layout is correct. If issues persist, consult the datasheet and application notes for further guidance.
  • Yes, the SZ1SMB5921BT3G is a sensitive device and requires proper ESD precautions during handling and assembly. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.

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SZ1SMB5921BT3G Overview

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