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SZ1SMB5931BT3G-VF01 - onsemi

Description: Zener Voltage Range − 3.3 V to 200 V • ESD Rating of Class 3 (> 16 kV) per Human Body Model • Flat Handling Surface for Accurate Placement • Package Design for Top Side or Bottom Circuit Board Mounting • AEC−Q101 Qualified and PPAP Capable − SZ1SMB59xxT3G • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements • These are Pb−Free Devices*

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SZ1SMB5931BT3G-VF01 - onsemi - PCB symbol
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PCB Footprints
SZ1SMB5931BT3G-VF01 - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A−03 ISSUE J
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SZ1SMB5931BT3G-VF01 - onsemi - 3D model - Diodes Moulded - SMB CASE 403A−03 ISSUE J
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SZ1SMB5931BT3G-VF01 Details

  • Manufacturer Part Number:

    SZ1SMB5931BT3G-VF01

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2018-07-11

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    12 Ω

  • Forward Voltage-Max (VF):

    1.5 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    650 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    18 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    13.7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    20.8 mA

SZ1SMB5931BT3G-VF01 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZ1SMB5931BT3G-VF01 is a standard SOD-123 package with a 2.5mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal conduction and heat dissipation on the PCB.
  • The maximum allowable voltage stress on the SZ1SMB5931BT3G-VF01 is 30V. Exceeding this voltage may cause permanent damage to the device.
  • Yes, the SZ1SMB5931BT3G-VF01 can be used in switching regulator applications. However, ensure that the device is operated within its recommended operating conditions and that the switching frequency is within the device's specified frequency range.
  • The recommended storage condition for the SZ1SMB5931BT3G-VF01 is in a dry, cool place with a temperature range of -40°C to 125°C and humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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SZ1SMB5931BT3G-VF01 Overview

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