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SZ1SMB5933BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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SZ1SMB5933BT3G - onsemi - PCB symbol
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PCB Footprints
SZ1SMB5933BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - .SMB CASE 403A−03 ISSUE J
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SZ1SMB5933BT3G - onsemi - 3D model - Diodes Moulded - .SMB CASE 403A−03 ISSUE J
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SZ1SMB5933BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5933BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    17.5 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    650 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    22 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    16.7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    17 mA

SZ1SMB5933BT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZ1SMB5933BT3G is a standard SOD-323 package with a 1.7mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation of the SZ1SMB5933BT3G according to the thermal derating curve provided in the datasheet. Additionally, ensure good thermal conduction between the device and the PCB, and consider using a heat sink if necessary.
  • The maximum allowable voltage stress on the SZ1SMB5933BT3G is 30V, as specified in the datasheet. Exceeding this voltage may result in device damage or failure.
  • Yes, the SZ1SMB5933BT3G is suitable for high-frequency applications up to 1 GHz. However, it is recommended to evaluate the device's performance in the specific application and consider the effects of parasitic inductance and capacitance.
  • To prevent ESD damage, handle the SZ1SMB5933BT3G with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the workspace and tools are grounded, and avoid touching the device's pins or leads.

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SZ1SMB5933BT3G Overview

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