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SZ1SMB5936BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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SZ1SMB5936BT3G - onsemi - PCB symbol
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SZ1SMB5936BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SZ1SMB5aaa936BT3G
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SZ1SMB5936BT3G - onsemi - 3D model - Diodes Moulded - SZ1SMB5aaa936BT3G
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SZ1SMB5936BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5936BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    26 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    750 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    30 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    22.8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    12.5 mA

SZ1SMB5936BT3G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZ1SMB5936BT3G involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a common ground point for the input and output grounds.
  • To ensure proper biasing, the SZ1SMB5936BT3G requires a stable input voltage between 2.5V and 5.5V, and a bias current of around 1mA. The device should also be operated within the recommended temperature range of -40°C to 125°C.
  • The SZ1SMB5936BT3G has a thermal resistance of 125°C/W, and a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management, especially in high-power applications.
  • To protect the SZ1SMB5936BT3G from ESD and overvoltage, it's recommended to use ESD protection devices, such as TVS diodes, and overvoltage protection circuits, such as voltage regulators or zener diodes. Additionally, following proper handling and storage procedures can help prevent ESD damage.
  • The SZ1SMB5936BT3G is manufactured by onsemi, which adheres to strict quality and reliability standards, including ISO 9001 and AEC-Q100. The device is also qualified to meet the requirements of various industry standards, such as automotive and industrial applications.

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SZ1SMB5936BT3G Overview

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