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SZ1SMB5940BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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SZ1SMB5940BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A−03 ISSUE J
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SZ1SMB5940BT3G - onsemi  - 3D model - Diodes Moulded - SMB CASE 403A−03 ISSUE J
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SZ1SMB5940BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5940BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    53 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    950 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    43 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    32.7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    8.7 mA

SZ1SMB5940BT3G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for the SZ1SMB5940BT3G includes a solid ground plane, short and wide traces for the input and output pins, and a decoupling capacitor (e.g., 100nF) between the VIN and GND pins to reduce noise and improve stability.
  • To ensure the SZ1SMB5940BT3G operates within its SOA, monitor the device's junction temperature (TJ) and ensure it does not exceed the maximum rated temperature (150°C). Also, keep the voltage and current within the recommended operating ranges, and avoid operating the device in a region where the voltage and current ratings are exceeded simultaneously.
  • A recommended input capacitor value for the SZ1SMB5940BT3G is 10uF to 22uF, with a low ESR (Equivalent Series Resistance) and a voltage rating that matches or exceeds the input voltage. A ceramic or film capacitor with an X7R or X5R dielectric is suitable for this application.
  • To protect the SZ1SMB5940BT3G from overvoltage and overcurrent conditions, consider adding overvoltage protection (OVP) and overcurrent protection (OCP) circuits. OVP can be achieved using a voltage supervisor or a zener diode, while OCP can be implemented using a current sense resistor and a comparator or a dedicated OCP IC.
  • The thermal resistance of the SZ1SMB5940BT3G package is typically around 10°C/W to 15°C/W, depending on the specific package type and PCB design. This value can be used to estimate the junction temperature (TJ) based on the power dissipation and ambient temperature.

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SZ1SMB5940BT3G Overview

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