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SZ1SMB5949BT3G - onsemi

Description: Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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SZ1SMB5949BT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SZ1SMB5949BT3G
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SZ1SMB5949BT3G - onsemi  - 3D model - Diodes Moulded - SZ1SMB5949BT3G
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SZ1SMB5949BT3G Details

  • Manufacturer Part Number:

    SZ1SMB5949BT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    250 Ω

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    3100 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    100 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    76 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    L BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    3.7 mA

SZ1SMB5949BT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZ1SMB5949BT3G is a standard SOD-123 package with a 1.5mm x 1.5mm pad size and a 0.5mm x 0.5mm thermal pad.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended operating temperature range (-55°C to 150°C), and provide adequate heat sinking and thermal management to prevent overheating.
  • The maximum allowable voltage for the SZ1SMB5949BT3G is 600V, as specified in the datasheet. Exceeding this voltage may result in device damage or failure.
  • To handle ESD protection for the SZ1SMB5949BT3G, follow proper ESD handling procedures, such as using ESD-safe workstations, wrist straps, and packaging materials, and ensure that the device is properly grounded during handling and assembly.
  • The recommended storage condition for the SZ1SMB5949BT3G is in a dry, cool place, away from direct sunlight and moisture, with a temperature range of -40°C to 30°C and relative humidity below 60%.

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SZ1SMB5949BT3G Overview

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