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SZ1SMB9.0AT3G - LITTELFUSE

Description: ESD Suppressors / TVS Diodes ZENER 600W

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PCB Footprints
SZ1SMB9.0AT3G - LITTELFUSE PCB footprint - Diodes Moulded - Diodes Moulded - DO-214 AA
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3D Models
SZ1SMB9.0AT3G - LITTELFUSE  - 3D model - Diodes Moulded - DO-214 AA
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SZ1SMB9.0AT3G Details

  • Manufacturer Part Number:

    SZ1SMB9.0AT3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Breakdown Voltage-Max:

    11.1 V

  • Breakdown Voltage-Min:

    10 V

  • Breakdown Voltage-Nom:

    10.55 V

  • Clamping Voltage-Max:

    15.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    9 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    9 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SZ1SMB9.0AT3G Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for SZ1SMB9.0AT3G can be found in the Littelfuse application note 'Surface Mount Land Pattern and Stencil Recommendations' (AN9313). It provides detailed guidelines for designing a reliable and efficient PCB layout.
  • Littelfuse offers different SMB package variants, such as SZ1SMB9.0AT3G, SZ1SMB9.0BT3G, and SZ1SMB9.0CT3G. The main difference is the lead frame material and plating. The 'A' variant has a copper lead frame with tin-silver-copper plating, while the 'B' variant has a copper lead frame with matte-tin plating, and the 'C' variant has a copper lead frame with gold plating. Choose the variant that best suits your application's requirements for solderability, corrosion resistance, and cost.
  • According to the datasheet, the maximum allowable voltage derating for SZ1SMB9.0AT3G is 10% above the rated voltage (9V). This means the device can withstand up to 9.9V without compromising its performance or reliability.
  • The SZ1SMB9.0AT3G is rated for operation up to 150°C. However, it's essential to consider the device's power dissipation and thermal management in high-temperature applications. Ensure that the device is properly cooled, and the junction temperature (Tj) does not exceed the maximum rating of 150°C.
  • To ensure the reliability of SZ1SMB9.0AT3G in humid or corrosive environments, follow proper PCB design and assembly guidelines, such as using a conformal coating, applying a moisture-resistant sealant, and ensuring good solder joints. Additionally, consider using a variant with a more corrosion-resistant plating, such as the 'C' variant with gold plating.

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SZ1SMB9.0AT3G Overview

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