Description:250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
The recommended PCB footprint for the SZBZX84C10LT1G is a standard SOD-123 package footprint with a 1.5mm x 1.5mm pad size and a 0.5mm x 0.5mm thermal pad.
To ensure the SZBZX84C10LT1G operates within its SOA, ensure the device is operated within the recommended voltage and current ratings, and that the junction temperature is kept below the maximum rating of 150°C.
The recommended storage condition for the SZBZX84C10LT1G is in a dry, cool place with a temperature range of -40°C to 30°C and humidity below 60%.
Yes, the SZBZX84C10LT1G is suitable for high-reliability applications due to its robust design and manufacturing process. However, it's essential to follow proper design and assembly guidelines to ensure the device operates within its specifications.
Handle the SZBZX84C10LT1G by the body, avoiding touching the leads or die. Use anti-static wrist straps, mats, or other ESD protection devices to prevent electrostatic discharge damage.
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SZBZX84C10LT1G Overview
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