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SZBZX84C3V3LT1G - onsemi

Description: 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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Symbol
SZBZX84C3V3LT1G - onsemi - PCB symbol
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PCB Footprints
SZBZX84C3V3LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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3D Models
SZBZX84C3V3LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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SZBZX84C3V3LT1G Details

  • Manufacturer Part Number:

    SZBZX84C3V3LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    95 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    6.06%

  • Working Test Current:

    5 mA

SZBZX84C3V3LT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZBZX84C3V3LT1G should prioritize thermal dissipation. Ensure a solid ground plane, use thermal vias, and keep the component away from heat sources. A 2-3 layer board with a dedicated thermal layer is recommended.
  • To ensure the SZBZX84C3V3LT1G operates within the SOA, monitor the device's voltage, current, and power dissipation. Use the datasheet's SOA graph to determine the maximum allowable voltage and current for your application.
  • The SZBZX84C3V3LT1G is an ESD-sensitive device. Handle it with ESD-protective equipment, and follow proper handling procedures to prevent damage. Use an anti-static wrist strap, mat, or workstation, and avoid touching the device's pins.
  • The SZBZX84C3V3LT1G is a commercial-grade device, but onsemi offers automotive-grade and high-reliability versions of similar products. Contact onsemi for more information on their AEC-Q101 or high-reliability offerings.
  • The thermal resistance values for the SZBZX84C3V3LT1G are not explicitly stated in the datasheet. However, you can estimate the thermal resistance using the package dimensions and material properties. Consult onsemi's application notes or contact their support team for more information.

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SZBZX84C3V3LT1G Overview

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