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SZBZX84C3V6LT3G - onsemi

Description: 250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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PCB Footprints
SZBZX84C3V6LT3G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236)--
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3D Models
SZBZX84C3V6LT3G - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236)--
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SZBZX84C3V6LT3G Details

  • Manufacturer Part Number:

    SZBZX84C3V6LT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    40 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3.6 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

SZBZX84C3V6LT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZBZX84C3V6LT3G is a standard SOT23 package with a 1.3mm x 1.3mm body size. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure proper biasing, follow the datasheet's recommended operating conditions, including the input voltage range (2.7V to 5.5V) and the output voltage range (1.8V to 5.5V). Additionally, ensure the input voltage is stable and within the recommended range to maintain optimal performance.
  • The maximum power dissipation of the SZBZX84C3V6LT3G is 250mW. However, it's essential to consider the device's thermal characteristics, such as the junction-to-ambient thermal resistance (RθJA), to ensure the device operates within a safe temperature range.
  • The SZBZX84C3V6LT3G is rated for operation up to 150°C (Tj). However, it's crucial to consider the device's thermal characteristics and ensure proper heat sinking to maintain a safe operating temperature. Consult the datasheet for more information on thermal management.
  • The SZBZX84C3V6LT3G has built-in ESD protection, but it's still essential to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap, mat, or other protective equipment to prevent damage from static electricity.

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