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SZMM3Z16VST1G - onsemi

Description: Standard Zener Breakdown Voltage Range - 2.4 V to 75 V; Steady State Power Rating of 300 mW; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics:; Tight Tolerance ; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; FLAMMABILITY RATING: UL94 V-0; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; AEC-Q101 Qualified and PPAP Capable ; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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SZMM3Z16VST1G - onsemi - PCB symbol
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PCB Footprints
SZMM3Z16VST1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323 - case 477-02 - issue H
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3D Models
SZMM3Z16VST1G - onsemi - 3D model - Small Outline Diode - SOD-323 - case 477-02 - issue H
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SZMM3Z16VST1G Details

  • Manufacturer Part Number:

    SZMM3Z16VST1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    16 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    2.04%

  • Working Test Current:

    5 mA

SZMM3Z16VST1G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SZMM3Z16VST1G is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask opening of 0.5 mm x 0.5 mm. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal issues.
  • To handle thermal management, ensure a good thermal interface between the device and the PCB. Use a thermal pad or a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Also, ensure good airflow around the device and consider using a heat sink if necessary.
  • The maximum allowed voltage derating for the SZMM3Z16VST1G is 10% of the nominal voltage rating. This means that if the device is rated for 16V, the maximum allowed voltage derating would be 1.6V (10% of 16V). Exceeding this limit may affect the device's reliability and lifespan.
  • Yes, the SZMM3Z16VST1G can be used in high-frequency applications. However, it's essential to consider the device's parasitic capacitance and inductance, which may affect the circuit's performance at high frequencies. Ensure proper PCB layout and component selection to minimize these effects.
  • To ensure proper soldering, follow the recommended soldering profile: peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Use a solder with a melting point of 217°C to 221°C. Avoid excessive soldering temperatures and times to prevent damage to the device.

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SZMM3Z16VST1G Overview

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