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SZMM3Z3V9T1G - onsemi

Description: Wide Zener Voltage Range Selection, 2.4V to 75V; VZ Tolerance Selection of ±5% (C Series); Very Small and Thin SMD package; Matte Tin(Sn) finish, Pb Free

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PCB Footprints
SZMM3Z3V9T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD−323-2021
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3D Models
SZMM3Z3V9T1G - onsemi  - 3D model - Small Outline Diode - SOD−323-2021
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SZMM3Z3V9T1G Details

  • Manufacturer Part Number:

    SZMM3Z3V9T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    90 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1000 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3.9 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5.13%

  • Working Test Current:

    5 mA

SZMM3Z3V9T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients. Additionally, consider using a thermistor or thermocouple to monitor the device temperature and adjust the operating conditions accordingly.
  • The SZMM3Z3V9T1G has an integrated ESD protection diode, but it's still recommended to follow standard ESD handling procedures when handling the device. A minimum of 10kΩ resistance and 100pF capacitance should be used in series with the input pins to prevent ESD damage.
  • Yes, the SZMM3Z3V9T1G is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly derated for the specific application. Additionally, consult with onsemi's application engineers for specific guidance on using this device in high-reliability applications.
  • Store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads. Follow standard moisture-sensitive device handling procedures, and bake the devices according to the recommended schedule if they are exposed to moisture.

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SZMM3Z3V9T1G Overview

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