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SZMMBZ27VCLT3G - onsemi

Description: SOT-23 Package; Working Peak Reverse Voltage Range - 12.8 V, 22 V, 31.2

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SZMMBZ27VCLT3G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SZMMBZ27VCLT3G-1
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SZMMBZ27VCLT3G - onsemi  - 3D model - SOT23 (3-Pin) - SZMMBZ27VCLT3G-1
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SZMMBZ27VCLT3G Details

  • Manufacturer Part Number:

    SZMMBZ27VCLT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Breakdown Voltage-Max:

    28.35 V

  • Breakdown Voltage-Min:

    25.65 V

  • Breakdown Voltage-Nom:

    27 V

  • Clamping Voltage-Max:

    38 V

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    40 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    22 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    22 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZMMBZ27VCLT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZMMBZ27VCLT3G is a standard SOD-123 package with a 1.7mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, ensure the device is operated within its recommended operating temperature range (-55°C to 150°C). Also, consider using a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device.
  • The maximum allowable voltage for the SZMMBZ27VCLT3G is 30V. Exceeding this voltage may cause permanent damage to the device.
  • To handle ESD protection for the SZMMBZ27VCLT3G, follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. The device itself has built-in ESD protection, but external precautions are still necessary.
  • The recommended storage condition for the SZMMBZ27VCLT3G is in a dry, cool place, away from direct sunlight and moisture. Store the devices in their original packaging or in a sealed bag with desiccant to maintain a relative humidity below 60%.

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SZMMBZ27VCLT3G Overview

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