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SZMMBZ5240ELT1G - onsemi

Description: Zener Voltage Range - 2.4 V to 91 V; 225 mW Rating on FR-4 or FR-5 Board; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMABILITY RATING:

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Symbol
SZMMBZ5240ELT1G - onsemi - PCB symbol
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PCB Footprints
SZMMBZ5240ELT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
SZMMBZ5240ELT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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SZMMBZ5240ELT1G Details

  • Manufacturer Part Number:

    SZMMBZ5240ELT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Additional Feature:

    IR-NOM

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    17 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    10 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    20 mA

SZMMBZ5240ELT1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern for the SZMMBZ5240ELT1G can be found in the onsemi application note AND8406/D, which provides guidelines for optimal performance and thermal management.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal management guidelines, including proper heat sinking, thermal interface materials, and airflow. Additionally, the device should be operated within the specified temperature range and derating guidelines.
  • The SZMMBZ5240ELT1G has built-in ESD protection, but it is still essential to follow proper handling and storage precautions to prevent damage. This includes using anti-static wrist straps, mats, and bags, as well as avoiding direct contact with the device pins.
  • The SZMMBZ5240ELT1G is a commercial-grade device, but onsemi offers automotive-grade and high-reliability versions of similar devices. Engineers should consult with onsemi's sales team or application engineers to determine the best device for their specific application.
  • The recommended soldering and rework conditions for the SZMMBZ5240ELT1G can be found in the onsemi application note AND8003/D, which provides guidelines for soldering, desoldering, and rework procedures.

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