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SZMMQA33VT1G - onsemi

Description: Small Package Size for High Density Applications; FINISH:Corrosion Resistant Finish, Easily Solderable; Package Designed for Optimal Automated Board Assembly; Available in 8 mm Tape and Reel Use the Device Number to order the 7 inch/3,000 unit reel. Replace with "T3" in the Device Number to order the 13 inch/10,000 unit reel.; Low Leakage < 2.0 mA; SC-59 Package Allows Four Separate Unidirectional Configurations; CASE:Void Free, Transfer-Molded, Thermosetting Plastic Case; Peak Power - Min. 24 W @ 1.0 ms (U

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PCB Footprints
SZMMQA33VT1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC−74
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3D Models
SZMMQA33VT1G - onsemi  - 3D model - SOT23 (6-Pin) - SC−74
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SZMMQA33VT1G Details

  • Manufacturer Part Number:

    SZMMQA33VT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-74 (SC-59ML) 6 LEAD

  • Package Description:

    SC-74, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    318F-05

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Breakdown Voltage-Max:

    34.7 V

  • Breakdown Voltage-Min:

    31.4 V

  • Breakdown Voltage-Nom:

    33 V

  • Clamping Voltage-Max:

    48.6 V

  • Configuration:

    COMMON ANODE, 4 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    150 W

  • Number of Elements:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    25 V

  • Reverse Current-Max:

    0.075 µA

  • Reverse Test Voltage:

    25 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZMMQA33VT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to allow heat to escape.
  • Ensure that the device is operated within the recommended voltage and current ratings. Also, consider the thermal derating curves provided in the datasheet to ensure the device does not exceed its maximum junction temperature.
  • Use a human body model (HBM) ESD protection circuit at the input pins, and consider adding a TVS (transient voltage suppressor) diode for additional protection. Ensure that the PCB layout is designed to minimize parasitic inductance and capacitance.
  • Optimize the PCB layout to minimize parasitic inductance and resistance. Use a low-ESR capacitor for decoupling, and consider using a heat sink or thermal interface material to improve thermal conductivity.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the leads or die. Use an anti-static wrist strap or mat when handling the device to prevent ESD damage.

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SZMMQA33VT1G Overview

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