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SZMMSZ3V3T1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

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Symbol
SZMMSZ3V3T1G - onsemi - PCB symbol
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PCB Footprints
SZMMSZ3V3T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123
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3D Models
SZMMSZ3V3T1G - onsemi - 3D model - Small Outline Diode - SOD-123
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SZMMSZ3V3T1G Details

  • Manufacturer Part Number:

    SZMMSZ3V3T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    95 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3.3 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

SZMMSZ3V3T1G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SZMMSZ3V3T1G is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a solder mask opening of 0.5 mm x 0.2 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The SZMMSZ3V3T1G has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources. Also, ensure good airflow around the component to prevent overheating.
  • The recommended soldering profile for the SZMMSZ3V3T1G is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • To ensure the reliability of the SZMMSZ3V3T1G in high-reliability applications, follow the recommended storage and handling procedures, and ensure that the component is operated within its specified ratings. Also, perform thorough testing and inspection during the manufacturing process to detect any defects or anomalies.
  • Yes, the SZMMSZ3V3T1G is AEC-Q101 qualified, making it suitable for use in automotive applications. However, ensure that the component is operated within its specified ratings and follows the recommended usage guidelines.

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SZMMSZ3V3T1G Overview

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