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SZMMSZ4688T1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

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Symbol
SZMMSZ4688T1G - onsemi - PCB symbol
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PCB Footprints
SZMMSZ4688T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD−123 CASE 425−04 ISSUE G_2020
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3D Models
SZMMSZ4688T1G - onsemi - 3D model - Small Outline Diode - SOD−123 CASE 425−04 ISSUE G_2020
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SZMMSZ4688T1G Details

  • Manufacturer Part Number:

    SZMMSZ4688T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    4.7 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    4.99%

  • Working Test Current:

    0.05 mA

SZMMSZ4688T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to onsemi's application note AND9093/D for more details.
  • Ensure proper thermal management, follow the recommended PCB layout, and consider using a thermal interface material (TIM) to minimize thermal resistance. Also, verify that the system's power supply and signal integrity meet the device's requirements.
  • The SZMMSZ4688T1G has built-in ESD protection, but handling precautions are still necessary. Use an ESD wrist strap or mat, and follow proper handling and storage procedures to prevent damage.
  • Yes, the SZMMSZ4688T1G is AEC-Q101 qualified and suitable for automotive and high-reliability applications. However, ensure that the device is used within its specified operating conditions and follow onsemi's guidelines for high-reliability applications.
  • Follow the soldering and rework guidelines outlined in onsemi's application note AND9095/D. Use a soldering iron with a temperature range of 250°C to 260°C, and ensure the device is not exposed to temperatures above 260°C for more than 10 seconds.

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SZMMSZ4688T1G Overview

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SZMMSZ4688T1G Alternates

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